Editor In Chief

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Chee Kai Chua   Mail
Head of Pillar, Engineering Product Development (EPD) Cheng Tsang Man Chair Professor, Singapore University of Technology and Design
Singapore

Associate Editors

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Swee Leong Sing   Mail
Department of Mechanical Engineering, National University of Singapore
Singapore

Editorial Board Members

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Shweta Agarwala   Mail
Department of Electrical and Computer Engineering, Aarhus University, Aarhus
Denmark
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Clodualdo Aranas Jr   Mail
Mechanical Engineering, University of New Brunswick
Canada
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Mohsen Akbari   Mail
Mechanical Engineering, University of Victoria
Canada
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Mahdi Bodaghi   Mail
Department of Engineering, School of Science and Technology, Nottingham Trent University
United Kingdom
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Thomas Boland   Mail
Professor, Metallurgical, Materials and Biomedical Engineering (MMBME)
United States
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Dongdong Gu   Mail
College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics
China
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Maling Gou   Mail
Sichuan University
China
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Charlotte Hauser   Mail
King Abdullah University of Science & Technology
Saudi Arabia
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Dong-Wook Han   Mail
Pusan National University (PNU)
Korea, Republic of
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Jingchao Jiang   Mail
The Chinese University of Hong Kong, Hong Kong
China
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Paulo Jorge da Silva Bártolo   Mail
Professor at the School of Mechanical and Aerospace Engineering (MAE), Nanyang Technological University (NTU)
Singapore
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Ming C Leu   Mail
Department of Mechanical and Aerospace Engineering, Missouri University of Science and Technology
United States
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Guha Manogharan   Mail
Mechanical Engineering, Pennsylvania State University
United States
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Tugrul Ozel   Mail
The Department of Industrial and Systems Engineering at Rutgers 
United States
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Eujin Pei   Mail
Brunel Design School, College of Engineering, Design & Physical Sciences, Brunel University London
United Kingdom
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Mui Ling Sharon Nai   Mail
Singapore Institute of Manufacturing Technology
Singapore
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Cijun Shuai   Mail
Institute of Bioadditive Manufacturing, Jiangxi University of Science and Technology
China
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Jing Shi   Mail
Department of Mechanical and Materials Engineering at University of Cincinnati, USA
United States
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Mika Salmi   Mail
Aalto University
Finland
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Dimitrios Tzetzis   Mail
School of Science and Technology, International Hellenic University
Greece
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Jonathan Phuong Tran   Mail
Department of Civil & Infrastructure Engineering, RMIT University
Australia
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Yiwei Weng   Mail
Department of Building and Real Estate, The Hong Kong Polytechnic University
China
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Chunze Yan   Mail
School of Materials Science and Engineering, Huazhong University of Science and Technology
China
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Wai Yee Yeong   Mail
Nanyang Technological University
Singapore
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Ali Zamanian   Mail
Head of Bioprinting Lab., Materials and Energy Research center, Tehran, Iran
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Yicha Zhang   Mail
Department of Mechanical & Design Engineering, University of Technology of Belfort-Montbéliard
France
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Jack G. Zhou   Mail
Department of Mechanical Engineering and Mechanics, College of Engineering, Drexel University
United States